Application: All high-density boards
Product Features: Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current: 140mA~1.6A
Maximum Voltage: 6V~60V
Temperature Range: -40°C to 85°C
Agency Recognition: UL (E211981), TÜV (R50004084)

 

 
 

Part

Number

Hold

Current

Trip

Current

Rated

Voltage

Max

Current

Typical

Power

Max Time to Trip

Resistance Tolerance

Current

Time

RMIN

R1MAX

IH, A

IT, A

VMAX, Vdc

IMAX, A

Pd, W

Amp

Sec

Ω

Ω

FSMD014

0.14

0.30

60

10

0.8

8.0

〈0.02

1.50

6.50

FSMD020

0.20

0.40

30

10

0.8

8.0

0.02

0.80

5.00

FSMD035

0.35

0.70

16

40

0.8

8.0

0.10

0.32

1.50

FSMD050

0.50

1.00

16

40

0.8

8.0

0.15

0.15

1.00

FSMD075

0.75

1.50

16

40

0.8

8.0

0.02

0.11

0.45

FSMD110

1.10

2.20

6

40

0.8

8.0

0.30

0.04

0.21

FSMD110-16

1.10

1.95

16

40

0.8

8.0

0.50

0.04

0.18

FSMD150

1.50

3.00

6

40

0.8

8.0

0.50

0.04

0.11

FSMD160

1.60

3.20

6

40

0.8

8.0

〈0.5

0.03

0.10

FSMD200

2.00

3.50

8

40

0.8

8.0

2

0.02

0.07

 

 

IH=Hold current-maximum current at which the device will not trip at 23℃still air.

IT=Trip current-minimum current at which the device will always trip at 23℃ still air.

V MAX=Maximum voltage device can withstand without damage at it rated current.(I max)

I MAX= Maximum fault current device can withstand without damage at rated voltage (V max).

Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.

RMIN=Minimum device resistance at 23℃ prior to tripping.

R1MAX=Maximum device resistance at 23℃ measured 1 hour post trip.

Termination pad characteristics

Termination pad materials: Tin-plated copper

 

 

 
                                       

PART

NUMBER

Figure

A

文字方塊: Figure 2

 
 

B

 

C

D

Min

Max

Min

Max

Min

Max

Min

FSMD014

1

4.37

4.73

3.07

3.41

0.60

0.90

0.3

FSMD020

1

4.37

4.73

3.07

3.41

0.60

0.90

0.3

FSMD035

1

4.37

4.73

3.07

3.41

0.40

0.70

0.3

FSMD050

1

4.37

4.73

3.07

3.41

0.35

0.65

0.3

FSMD075

1 or 2

4.37

4.73

3.07

3.41

0.35

0.65

0.3

FSMD110

1 or 2

4.37

4.73

3.07

3.41

0.25

0.55

0.3

FSMD110-16

2

4.37

4.73

3.07

3.41

0.25

0.55

0.3

FSMD150

2

4.37

4.73

3.07

3.41

0.25

0.55

0.3

FSMD160

2

4.37

4.73

3.07

3.41

0.25

0.90

0.3

FSMD200

2

4.37

4.73

3.07

3.41

0.50

0.90

0.3

 

 
 

 

 
 

 

 

A =FSMD014

B =FSMD020

C =FSMD035

D =FSMD050

E =FSMD075

F =FSMD110-16

G = FSMD110

H =FSMD150

I =FSMD160

J=FSMD200

 

 

 

 
 

P/N

 Pcs /Bag
 Reel/Tape

 

P/N

Pcs /Bag
Reel/Tape

FSMD014

--------

2K

FSMD110

--------

2K

FSMD020

--------

2K

FSMD110-16

--------

2K

FSMD035

--------

2K

FSMD150

--------

2K

FSMD050

--------

2K

FSMD160

--------

2K

FSMD075

--------

2K

 

FSMD200

--------

2K

 

 

 
Warning:
  1. Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.
  2. PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated.
  3. Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.

 

 
Pad Layouts, Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device

Pad dimensions (millimeters)

Device

A

Nominal

B

Nominal

C

Nominal

FSMD014

3.45

1.78

3.50

FSMD020

3.45

1.78

3.50

FSMD035

3.45

1.78

3.50

FSMD050

3.45

1.78

3.50

FSMD075

3.45

1.78

3.50

FSMD110

3.45

1.78

3.50

FSMD110-16

3.45

1.78

3.50

FSMD150

3.45

1.78

3.50

FSMD160

3.45

1.78

3.50

FSMD200

3.45

1.78

3.50

 


 Solder reflow
Due to “Lead Free” nature, up to 40 seconds Dwelling time for the soldering zone is strongly recommend .
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD1812 Series are suitable for use with wave-solder application methods.
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned using standard industry methods and solvents.

CAUTION:
If reflow temperatures exceed the recommended Profile, devices may not meet the performance requirements.

Rework:
Use standard industry practices.

All the specifications are subject to change without previous notice.